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1 pin description rev. 4.2, aug. 26, 2003 p/n: pm0157 32 tsop features ? 256kx 8 organization ? single +5v power supply ? +12.5v programming voltage ? fast access time:35/45/55/70/90/100/120/150 ns ? totally static operation ? completely ttl compatible ? operating current:30ma ? standby current: 100ua ? package type: - 32 pin plastic dip - 32 pin sop - 32 pin plcc - 32 pin tsop( i ) general description the mx27c2000 is a 5v only, 2m-bit, one time programmable read only memory. it is organized as 256k words by 8 bits per word, operates from a single + 5 volt supply, has a static standby mode, and features fast single address location programming. all program- ming signals are ttl levels, requiring a single pulse. for programming outside from the system, existing eprom programmers may be used. the mx27c2000 supports a intelligent fast programming algorithm which can result in programming time of less than one minute. this eprom is packaged in industry standard 32 pin dual-in-line packages, 32 lead sop, 32 lead plcc and 32 lead tsop (i) packages. pin configurations 32 pdip/sop block diagram 32 plcc symbol pin name a0~a17 address input q0~q7 data input/output ce chip enable input oe output enable input pgm programmable enable input vpp program supply voltage nc no internal connection vcc power supply pin (+5v) gnd ground pin mx27c2000 2m-bit [256k x 8] cmos eprom 1 4 5 9 13 14 17 20 21 25 29 32 30 a14 a13 a8 a9 a11 oe a10 ce q7 a7 a6 a5 a4 a3 a2 a1 a0 q0 q1 q2 gnd q3 q4 q5 q6 a12 a15 a16 vpp vcc pgm a17 mx27c2000 a11 a9 a8 a13 a14 a17 pgm vcc vpp a16 a15 a12 a7 a6 a5 a4 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 oe a10 ce q7 q6 q5 q4 q3 gnd q2 q1 q0 a0 a1 a2 a3 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 mx27c2000 control logic output buffers q0~q7 ce pgm oe a0~a17 address inputs y-decoder x-decoder y-select 2m bit cell maxtrix vcc vss vpp . . . . . . . . . . . . . . . . mx27c2000 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 vpp a16 a15 a12 a7 a6 a5 a4 a3 a2 a1 a0 q0 q1 q2 gnd 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 vcc pgm a17 a14 a13 a8 a9 a11 oe a10 ce q7 q6 q5 q4 q3
2 rev. 4.2, aug. 26, 2003 p/n: pm0157 mx27c2000 auto identify mode the auto identify mode allows the reading out of a binary code from an eprom that will identify its manufacturer and device type. this mode is intended for use by programming equipment for the purpose of automatically matching the device to be programmed with its corresponding programming algorithm. this mode is functional in the 25 c 5 c ambient temperature range that is required when programming the mx27c2000. to activate this mode, the programming equipment must force 12.0 0.5 v on address line a9 of the device. two identifier bytes may then be sequenced from the device outputs by toggling address line a0 from vil to vih. all other address lines must be held at vil during auto identify mode. byte 0 ( a0 = vil) represents the manufacturer code, and byte 1 (a0 = vih), the device identifier code. for the mx27c2000, these two identifier bytes are given in the mode select table. all identifiers for manufacturer and device codes will possess odd parity, with the msb (q7) defined as the parity bit. read mode the mx27c2000 has two control functions, both of which must be logically satisfied in order to obtain data at the outputs. chip enable (ce) is the power control and should be used for device selection. output enable (oe) is the output control and should be used to gate data to the output pins, independent of device selection. assuming that addresses are stable, address access time (tacc) is equal to the delay from ce to output (tce). data is available at the outputs toe after the falling edge of oe, assuming that ce has been low and addresses have been stable for at least tacc - toe. standby mode the mx27c2000 has a cmos standby mode which reduces the maximum vcc current to 100 ua. it is placed in cmos standby when ce is at vcc 0.3 v. the mx27c2000 also has a ttl-standby mode which reduces the maximum vcc current to 1.5 ma. it is placed in ttl-standby when ce is at vih. when in standby mode, the outputs are in a high-impedance state, independent of the oe input. functional description the programming of the mx27c2000 when the mx27c2000 is delivered, or it is erased, the chip has all 2m bits in the "one", or high state. "zeros" are loaded into the mx27c2000 through the procedure of programming. for programming, the data to be programmed is applied with 8 bits in parallel to the data pins. vcc must be applied simultaneously or before vpp, and removed simultaneously or after vpp. when programming an mxic eprom, a 0.1uf capacitor is required across vpp and ground to suppress spurious voltage transients which may damage the device. fast programming the device is set up in the fast programming mode when the programming voltage vpp = 12.75v is applied, with vcc = 6.25 v and pgm = vih (algorithm is shown in figure 1). the programming is achieved by applying a single ttl low level 100us pulse to the pgm input after addresses and data line are stable. if the data is not verified, an additional pulse is applied for a maximum of 25 pulses. this process is repeated while sequencing through each address of the device. when the programming mode is completed, the data in all address is verified at vcc = vpp = 5v 10%. program inhibit mode programming of multiple mx27c2000s in parallel with different data is also easily accomplished by using the program inhibit mode. except for ce and oe, all like inputs of the parallel mx27c2000 may be common. a ttl low-level program pulse applied to an mx27c2000 ce input with vpp = 12.5 0.5 v and pgm low will program that mx27c2000. a high-level ce input inhibits the other mx27c2000s from being programmed. program verify mode verification should be performed on the programmed bits to determine that they were correctly programmed. the verification should be performed with oe and ce at vil, pgm at vih, and vpp at its programming voltage.
3 rev. 4.2, aug. 26, 2003 p/n: pm0157 mx27c2000 system considerations during the switch between active and standby conditions, transient current peaks are produced on the rising and falling edges of chip enable. the magnitude of these transient current peaks is dependent on the output capacitance loading of the device. at a minimum, a 0.1 uf ceramic capacitor (high frequency, low inherent inductance) should be used on each device between vcc and gnd to minimize transient effects. in addition, to overcome the voltage drop caused by the inductive effects of the printed circuit board traces on eprom arrays, a 4.7 uf bulk electrolytic capacitor should be used between vcc and gnd for each eight devices. the location of the capacitor should be close to where the power supply is connected to the array. notes: 1. vh = 12.0 v 0.5 v 2. x = either vih or vil 3. a1 - a8 = a10 - a17 = vil(for auto select) 4. see dc programming characteristics for vpp voltage during programming. mode select table pins mode ce oe pgm a0 a9 vpp outputs read vil vil x x x vcc dout output disable vil vih x x x vcc high z standby (ttl) vih x x x x vcc high z standby (cmos) vcc 0.3v x x x x vcc high z program vil vih vil x x vpp din program verify vil vil vih x x vpp dout program inhibit vih x x x x vpp high z manufacturer code(3) vil vil x vil vh vcc c2h device code(3) vil vil x vih vh vcc 20h two-line output control function to accommodate multiple memory connections, a two- line control function is provided to allow for: 1. low memory power dissipation, 2. assurance that output bus contention will not occur. it is recommended that ce be decoded and used as the primary device-selecting function, while oe be made a common connection to all devices in the array and connected to the read line from the system control bus. this assures that all deselected memory devices are in their low-power standby mode and that the output pins are only active when data is desired from a particular memory device.
4 rev. 4.2, aug. 26, 2003 p/n: pm0157 mx27c2000 start address = first location vcc = 6.25v vpp = 12.75v x = 0 program one 100us pulse increment x x = 25? verify byte last address vcc = vpp = 5.25v device passed verify all bytes ? device failed increment address interactive section verify section fail pass yes pass no yes no fail figure 1. fast programming flow chart fail ?
5 rev. 4.2, aug. 26, 2003 p/n: pm0157 mx27c2000 switching test circuits switching test waveforms 2.0v 0.8v test points input 2.0v 0.8v output ac testing: ac driving levels are 2.4v/0.4v for commercial grade,3.0v/0v for industrial grade. input pulse rise and fall times are equal to or less than 10ns. ac driving levels device under test diodes = in3064 or equivalent cl = 100 pf including jig capacitance (30pf for mx27c2000-35/45/55/70) 6.2k ohm 1.8k ohm +5v cl 1.5v test points input 1.5v output ac testing: (1) ac driving levels are 3.0v/0v for commercial grade. input pulse rise and fall times are equal to or less than 10ns. (2) for mx27c2000-35/45/55/70. ac driving levels
6 rev. 4.2, aug. 26, 2003 p/n: pm0157 mx27c2000 mx27c2000 -35 -45 -55 -70 -90 -10 -12 -15 operating commercial 0 c to 55 c0 c to 55 c0 c to 70 c0 c to 70 c0 c to 70 c0 c to 70 c0 c to 70 c0 c to 70 c temperature industrial -40 c to 85 c-40 c to 85 c -40 c to 85 c-40 c to 85 c -40 c to 85 c-40 c to 85 c vcc power supply 5v 5% 5v 5% 5v 5% 5v 10% 5v 10% 5v 10% 5v 10% 5v 10% dc characteristics symbol parameter min. max. unit conditions voh output high voltage 2.4 v ioh = -0.4ma vol output low voltage 0.4 v iol = 2.1ma vih input high voltage 2.0 vcc + 0.5 v vil input low voltage -0.3 0.8 v ili input leakage current -10 10 ua vin = 0 to 5.5v ilo output leakage current -10 10 ua vout = 0 to 5.5v icc3 vcc power-down current 100 ua ce = vcc 0.3v icc2 vcc standby current 1.5 ma ce = vih icc1 vcc active current 30 ma ce = vil, f=5mhz, iout = 0ma ipp vpp supply current read 10 ua ce = oe = vil, vpp = 5.5v notice: stresses greater than those listed under absolute maximum ratings may cause permanent damage to the device. this is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. exposure to absolute maximum rating conditions for extended period may affect reliability. notice: specifications contained within the following tables are subject to change. dc/ac operating condition for read operation absolute maximum ratings rating value ambient operating temperature -40 o c to 85 o c storage temperature -65 o c to 125 o c applied input voltage -0.5v to 7.0v applied output voltage -0.5v to vcc + 0.5v vcc to ground potential -0.5v to 7.0v v9 & vpp -0.5v to 13.5v capacitance ta = 25 o c, f = 1.0 mhz (sampled only) symbol parameter typ. max. unit conditions cin input capacitance 8 12 pf vin = 0v cout output capacitance 8 12 pf vout = 0v cvpp vpp capacitance 18 25 pf vpp = 0v
7 rev. 4.2, aug. 26, 2003 p/n: pm0157 mx27c2000 ac characteristics 27c2000-90 27c2000-10 27c2000-12 27c2000-15 symbol parameter min. max. min. max. min. max. min. max. unit conditions tacc address to output delay 90 100 120 150 ns ce = oe = vil tce chip enable to output delay 90 100 120 150 ns oe = vil toe output enable to output delay 40 45 50 65 ns ce = vil tdf oe high to output float, 0 25 0 30 0 35 0 50 ns or ce high to output float toh output hold from address,ce or 0 0 0 0 ns oe which ever occurred first 27c2000-35 27C2000-45 27c2000-55 27c2000-70 symbol parameter min. max. min. max. min. max. min. max. unit conditions tacc address to output delay 35 45 55 70 ns ce = oe = vil tce chip enable to output delay 35 45 55 70 ns oe = vil toe output enable to output delay 15 20 25 30 ns ce = vil tdf oe high to output float, 0 15 0 15 0 20 0 20 ns or ce high to output float toh output hold from address,ce or 0 0 0 0 ns oe which ever occurred first
8 rev. 4.2, aug. 26, 2003 p/n: pm0157 mx27c2000 ac programming characteristics ta = 25 o c 5 c symbol parameter min. max. unit conditions tas address setup time 2.0 us toes oe setup time 2.0 us tds data setup time 2.0 us tah address hold time 0 us tdh data hold time 2.0 us tdfp output enable to output float delay 0 130 ns tvps vpp setup time 2.0 us tpw pgm program pulse width 95 105 us tvcs vcc setup time 2.0 us tces ce setup time 2.0 us toe data valid from oe 150 ns dc programming characteristics ta = 25 o c 5 c symbol parameter min. max. unit conditions voh output high voltage 2.4 v ioh = -0.40ma vol output low voltage 0.4 v iol = 2.1ma vih input high voltage 2.0 vcc + 0.5 v vil input low voltage -0.3 0.8 v ili input leakage current -10 10 ua vin = 0 to 5.5v vh a9 auto select voltage 11.5 12.5 v icc3 vcc supply current (program & verify) 50 ma ipp2 vpp supply current(program) 30 ma ce=pgm=vil,oe=vih vcc1 fast programming supply voltage 6.00 6.50 v vpp1 fast programming voltage 12.5 13.0 v
9 rev. 4.2, aug. 26, 2003 p/n: pm0157 mx27c2000 waveforms read cycle fast programming algorithm waveform address inputs data out oe ce data address valid data tdf tacc tce toe toh addresses ce oe pgm data vpp vcc vih vil vpp1 vcc vcc1 vcc vih vil vih vil vih vil data out valid hi-z data in stable tas tvps tvcs tces toe max tpw tds tdh toes tdfp tah program verify program
10 rev. 4.2, aug. 26, 2003 p/n: pm0157 mx27c2000 plastic package part no. access time operating standby operating package (ns) current max.(ma) current max.(ua) temperature mx27c2000pc-35 35 30 100 0 c to 55 c 32 pin dip mx27c2000qc-35 35 30 100 0 c to 55 c 32 pin plcc mx27c2000mc-35 35 30 100 0 c to 55 c 32 pin sop mx27c2000tc-35 35 30 100 0 c to 55 c 32 pin tsop mx27c2000pc-45 45 30 100 0 c to 55 c 32 pin dip mx27c2000qc-45 45 30 100 0 c to 55 c 32 pin plcc mx27c2000mc-45 45 30 100 0 c to 55 c 32 pin sop mx27c2000tc-45 45 30 100 0 c to 55 c 32 pin tsop mx27c2000pc-55 55 30 100 0 c to 70 c 32 pin dip mx27c2000qc-55 55 30 100 0 c to 70 c 32 pin plcc mx27c2000mc-55 55 30 100 0 c to 70 c 32 pin sop mx27c2000tc-55 55 30 100 0 c to 70 c 32 pin tsop mx27c2000pi-55 55 30 100 -40 c to 85 c 32 pin dip mx27c2000qi-55 55 30 100 -40 c to 85 c 32 pin plcc mx27c2000mi-55 55 30 100 -40 c to 85 c 32 pin sop mx27c2000ti-55 55 30 100 -40 c to 85 c 32 pin tsop mx27c2000pc-70 70 30 100 0 c to 70 c 32 pin dip mx27c2000qc-70 70 30 100 0 c to 70 c 32 pin plcc mx27c2000mc-70 70 30 100 0 c to 70 c 32 pin sop mx27c2000tc-70 70 30 100 0 c to 70 c 32 pin tsop mx27c2000pi-70 70 30 100 -40 c to 85 c 32 pin dip mx27c2000qi-70 70 30 100 -40 c to 85 c 32 pin plcc mx27c2000mi-70 70 30 100 -40 c to 85 c 32 pin sop mx27c2000ti-70 70 30 100 -40 c to 85 c 32 pin tsop mx27c2000pc-90 90 30 100 0 c to 70 c 32 pin dip mx27c2000qc-90 90 30 100 0 c to 70 c 32 pin plcc mx27c2000mc-90 90 30 100 0 c to 70 c 32 pin sop mx27c2000tc-90 90 30 100 0 c to 70 c 32 pin tsop mx27c2000pi-90 90 30 100 -40 c to 85 c 32 pin dip mx27c2000qi-90 90 30 100 -40 c to 85 c 32 pin plcc mx27c2000mi-90 90 30 100 -40 c to 85 c 32 pin sop mx27c2000ti-90 90 30 100 -40 c to 85 c 32 pin tsop mx27c2000pc-10 100 30 100 0 c to 70 c 32 pin dip mx27c2000qc-10 100 30 100 0 c to 70 c 32 pin plcc mx27c2000mc-10 100 30 100 0 c to 70 c 32 pin sop mx27c2000tc-10 100 30 100 0 c to 70 c 32 pin tsop mx27c2000pi-10 100 30 100 -40 c to 85 c 32 pin dip mx27c2000qi-10 100 30 100 -40 c to 85 c 32 pin plcc ordering information
11 rev. 4.2, aug. 26, 2003 p/n: pm0157 mx27c2000 part no. access time operating standby operating package (ns) current max.(ma) current max.(ua) temperature mx27c2000mi-10 100 30 100 -40 c to 85 c 32 pin sop mx27c2000ti-10 100 30 100 -40 c to 85 c 32 pin tsop mx27c2000pc-12 120 30 100 0 c to 70 c 32 pin dip mx27c2000qc-12 120 30 100 0 c to 70 c 32 pin plcc mx27c2000mc-12 120 30 100 0 c to 70 c 32 pin sop mx27c2000tc-12 120 30 100 0 c to 70 c 32 pin tsop mx27c2000pi-12 120 30 100 -40 c to 85 c 32 pin dip mx27c2000qi-12 120 30 100 -40 c to 85 c 32 pin plcc mx27c2000mi-12 120 30 100 -40 c to 85 c 32 pin sop mx27c2000ti-12 120 30 100 -40 c to 85 c 32 pin tsop mx27c2000pc-15 150 30 100 0 c to 70 c 32 pin dip mx27c2000qc-15 150 30 100 0 c to 70 c 32 pin plcc mx27c2000mc-15 150 30 100 0 c to 70 c 32 pin sop mx27c2000tc-15 150 30 100 0 c to 70 c 32 pin tsop mx27c2000pi-15 150 30 100 -40 c to 85 c 32 pin dip mx27c2000qi-15 150 30 100 -40 c to 85 c 32 pin plcc mx27c2000mi-15 150 30 100 -40 c to 85 c 32 pin sop mx27c2000ti-15 150 30 100 -40 c to 85 c 32 pin tsop
12 rev. 4.2, aug. 26, 2003 p/n: pm0157 mx27c2000 package information
13 rev. 4.2, aug. 26, 2003 p/n: pm0157 mx27c2000
14 rev. 4.2, aug. 26, 2003 p/n: pm0157 mx27c2000
15 rev. 4.2, aug. 26, 2003 p/n: pm0157 mx27c2000
16 rev. 4.2, aug. 26, 2003 p/n: pm0157 mx27c2000 revision history revision no. description page date 3.0 1) eliminate interactive programming mode. 06/11/1997 2) reduce operating current from 40ma to 30ma. 3.1 ipp 100ua --> 10ua 08/07/1997 3.2 change tsop orientation. 04/09/1998 3.3 add 45/55ns speed grades p1,5,6,7,10 11/19/1998 3.4 modify the operating temperature from 70 c to 55 c for the 45ns parts p6,10 02/02/1999 3.5 add 100ns speed grades p1,7,9,10 mar/16/1999 3.6 add 55ns/70ns speed grade for industrial grade parts p10,11 apr/27/1999 3.7 add 35ns speed for commerial grade p1,5-7,9-10 jul/13/1999 3.8 remove 27c2000dc-35 part number p10 aug/20/1999 3.9 cancel ceramic dip package type p1,2,10,13 feb/29/2000 4.0 cancel "ultraviolet erasable" wording in general description p1 aug/20/2001 to modify package information p12~15 4.1 to modify package information p12~15 nov/19/2002 4.2 to modify 32-plcc package information p14 aug/26/2003 a1: from 0.50mm(0.020 inch)/nom. to 0.58mm(0.023 inch)/nom. from 0.66mm(0.026 inch)/nom. to 0.81mm(0.032 inch)/nom.
mx27c2000 m acronix i nternational c o., l td. headquarters: tel:+886-3-578-6688 fax:+886-3-563-2888 europe office: tel:+32-2-456-8020 fax:+32-2-456-8021 japan office: tel:+81-44-246-9100 fax:+81-44-246-9105 singapore office: tel:+65-348-8385 fax:+65-348-8096 taipei office: tel:+886-2-2509-3300 fax:+886-2-2509-2200 m acronix a merica, i nc. tel:+1-408-453-8088 fax:+1-408-453-8488 chicago office: tel:+1-847-963-1900 fax:+1-847-963-1909 http : //www.macronix.com macronix international co., ltd. reserves the right to change product and specifications without notice.

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